A 256 × 8 SPAD line sensor for time resolved fluorescence and raman sensing

Nikola Krstajić, Richard Walker, James Levitt, Simon P. Poland, David Li, Simon Ameer-Beg, Robert Henderson

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

7 Citations (Scopus)

Abstract

A 256 × 8 single photon avalanche diode (SPAD) time-resolved single photon counting (TCPSC) line sensor enables both fluorescence and Raman spectroscopy in a single device. The 23.78μm pitch, 46.8% fill-factor SPAD array is implemented in a 0.13μm CMOS image sensor process. Integrating time to digital converters (TDCs) implement on-chip mono-exponential fluorescence lifetime pre-calculation allowing timing of 65k photons/pixel at 500s-1 line rate at 40ps resolution using centre-of-mass method (CMM). TCSPC histograms may also be generated with 320ps bin resolution for multi-exponential analysis.
Original languageEnglish
Title of host publicationEuropean Solid State Circuits Conference (ESSCIRC), ESSCIRC 2014 - 40th
PublisherIEEE
Pages143-146
Number of pages4
ISBN (Print)9781479956944
DOIs
Publication statusPublished - 22 Sep 2014
Event40th European Solid-State Circuits Conference - Palazzo del Casinò, Venice, Italy
Duration: 22 Sep 201426 Sep 2014
http://www.esscirc2014.org/en/sistemacongressi/european-solid-state-circuits-conference-2014/website/home/

Publication series

Name
ISSN (Print)1930-8833

Conference

Conference40th European Solid-State Circuits Conference
CountryItaly
CityVenice
Period22/09/1426/09/14
Internet address

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Keywords

  • time-digital conversion
  • avalanche diodes
  • CMOS image sensors
  • fluorescence spectroscopy
  • photon counting
  • Raman spectra
  • time resolved spectra
  • arrays
  • detectors
  • image resolution

Cite this

Krstajić, N., Walker, R., Levitt, J., Poland, S. P., Li, D., Ameer-Beg, S., & Henderson, R. (2014). A 256 × 8 SPAD line sensor for time resolved fluorescence and raman sensing. In European Solid State Circuits Conference (ESSCIRC), ESSCIRC 2014 - 40th (pp. 143-146). IEEE. https://doi.org/10.1109/ESSCIRC.2014.6942042