3-3 connectivity multilayered piezoelectric composites

R.L. O'Leary, G. Hayward, T.F. McCunnie, M. Kijowski

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

This paper describes a preliminary investigation of 3-3 connectivity multilayered piezoelectric composites that can be manufactured using the dice and fill technique. The dicing operation is undertaken such that the continuity of the surface electrode is maintained on the inner layer. The PZFlex finite element modelling package is used to investigate the resonant behaviour of a three layer design. Comparison is made between devices comprising uniform and non-uniform layer thickness: not all of the non-uniform layer designs that were investigated generate both the even and odd harmonics of the fundamental. Results from experimental devices, and a technique to minimise the inter layer bond thickness by the deposition of a controlled wet film thickness of the adhesive layer, are described.
Original languageEnglish
Pages1686-1689
Number of pages4
DOIs
Publication statusPublished - Aug 2005
Event2004 IEEE Ultrasonics Symposium - Montreal, Canada
Duration: 23 Aug 200427 Aug 2004

Conference

Conference2004 IEEE Ultrasonics Symposium
CountryCanada
CityMontreal
Period23/08/0427/08/04

Keywords

  • 3-3 connectivity
  • multilayered piezoelectric composites
  • dice and fill technique
  • surface electrode
  • PZFlex

Fingerprint Dive into the research topics of '3-3 connectivity multilayered piezoelectric composites'. Together they form a unique fingerprint.

  • Cite this

    O'Leary, R. L., Hayward, G., McCunnie, T. F., & Kijowski, M. (2005). 3-3 connectivity multilayered piezoelectric composites. 1686-1689. Paper presented at 2004 IEEE Ultrasonics Symposium , Montreal, Canada. https://doi.org/10.1109/ULTSYM.2004.1418148