Низкотемпературная деформация меди

The development and production of metals and alloys with grain sizes of tenths and hundredths of a micrometer (submicro- and nanocrystals) with desired physicochemical properties is an important problem of modern materials science [1]. Recently, a number of attempts have been made to use cryogenic deformation to grind grain size [2–4], and most of this work was performed on highly plastic copper. It seems relevant to a detailed study of the microstructure after cryogenic deformation, as well as the mechanisms of its formation. This work was aimed at a thorough certification of the microstructure of copper subjected to varying degrees of low-temperature deformation. For the certification of the microstructure, a relatively new method of automatic analysis of backscattered electron diffraction patterns (EBSD) was used.