Низкотемпературная деформация меди

Translated title of the contribution: Low-temperature deformation of copper

T.H. Konkova, S. Mironov, A. Korznikov

Research output: Contribution to conferenceProceedingpeer-review

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The development and production of metals and alloys with grain sizes of tenths and hundredths of a micrometer (submicro- and nanocrystals) with desired physicochemical properties is an important problem of modern materials science [1]. Recently, a number of attempts have been made to use cryogenic deformation to grind grain size [2–4], and most of this work was performed on highly plastic copper. It seems relevant to a detailed study of the microstructure after cryogenic deformation, as well as the mechanisms of its formation. This work was aimed at a thorough certification of the microstructure of copper subjected to varying degrees of low-temperature deformation. For the certification of the microstructure, a relatively new method of automatic analysis of backscattered electron diffraction patterns (EBSD) was used.
Translated title of the contributionLow-temperature deformation of copper
Original languageRussian
Number of pages4
Publication statusPublished - 13 Apr 2010
EventX Peterburgskie chteniya - St. Petersburg, Russian Federation
Duration: 13 Apr 201015 Apr 2010


ConferenceX Peterburgskie chteniya
Country/TerritoryRussian Federation
CitySt. Petersburg


  • cryogenic deformation
  • copper
  • nanocrystal architectures


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