Hybrid integration of GaN LEDs onto silica based PICs for data communications
Thin-film GaN LED devices are fabricated and transferred using an accurate pick and place technique onto glass optical chips. These glass chips are commonly used for telecommunications multiplexing and signal processing, and with the addition of compact on-chip light sources will enable the next generation of opto-electronic systems. Applications of the technology extend far beyond communications systems into biosensing and environmental monitoring.
|Effective start/end date||1/11/16 → 31/03/17|