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Personal profile

Personal Statement

Metal electroplating is of great significance in various industries and traditionally the process was performed in aqueous solution. However, such electrolyte suffers a number of drawbacks including poor deposit quality for some metals and environmental concerns. Deep eutectic solvents (DES) can serve as the alternative and overcome those limitations. In addition, metal deposit quality and properties can also be improved by applying pulse current instead of conventional direct current. This research aims to explore the combining effects of applying pulse plating technique in metal deposition using DES electrolyte  

Education/Academic qualification

Master of Engineering, Birmingham University

22 Sep 20131 Sep 2014

Bachelor of Engineering, Nottingham University

5 Sep 200923 Jun 2013

Fingerprint Dive into the research topics where Xiaomeng Su is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 31 Similar Profiles
Electrodeposition Chemical Compounds
Eutectics Chemical Compounds
Plating Chemical Compounds
Copper Chemical Compounds
Metals Chemical Compounds
Deposits Chemical Compounds
Ionic Liquids Chemical Compounds
Ionic liquids Engineering & Materials Science

Research Output 2016 2017

Electrodeposition of copper from deep eutectic solvents by using pulse current

Su, X., Green, T. & Roy, S., 28 Mar 2017. 1 p.

Research output: Contribution to conferencePoster

Open Access
File
Electrodeposition
Eutectics
Copper
Deposits
Metals
3 Citations (Scopus)

Pulse plating of copper from deep eutectic solvents

Green, T., Su, X. & Roy, S., 1 Aug 2017, In : ECS Transactions. 77, 11, p. 1247-1253 7 p.

Research output: Contribution to journalArticle

Open Access
File
Plating
Eutectics
Copper
Corrosion
Corrosion rate

Activities 2018 2018

  • 2 Oral presentation

Electrodeposition of Tin from Deep Eutectic Solvents Using Pulse Current

Xiaomeng Su (Speaker), Todd Green (Contributor), Sudipta Roy (Contributor)
16 Sep 201818 Sep 2018

Activity: Talk or presentation typesOral presentation

Cu Electrodeposition from Deep Eutectic Solvents using Pulse Current

Xiaomeng Su (Speaker), Todd Green (Contributor), Sudipta Roy (Contributor)
31 May 2018

Activity: Talk or presentation typesOral presentation