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20042019
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Research Output 2004 2019

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Conference contribution book
Conference contribution book
16 Downloads (Pure)

Annealing effect on the structure characteristics of nano-scale damascene copper lines

Konkova, T., Mironov, S., Ke, Y. & Onuki, J., 13 Jun 2013, 2013 IEEE International Interconnect Technology Conference, IITC 2013. Piscataway, N.J.: IEEE, 3 p. 6615574

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Open Access
File
Crystal microstructure
Electron diffraction
Annealing
Copper
Grain growth
9 Downloads (Pure)

Evolution of microstructure and residual stresses in a CP-Ti bioimplant produced by incremental sheet forming

Konkova, T., Mironov, S. & Rahimi, S., 1 Oct 2018, Ultrafine Grained and Nanostructured Materials: Abstracts of the Open School-Conference of NIS Countries. Ufa, Russian Federation, p. 142-143 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Open Access
File
Residual stresses
Microstructure
Metal forming
Metal drawing
Bending (forming)
1 Citation (Scopus)

Structural features of nano-scale damascene copper lines after annealing in wide temperature range

Konkova, T. N., Mironov, S. Y., Ke, Y. & Onuki, J., 4 Apr 2014, Processing, Materials, and Integration of Damascene and 3D Interconnects 5. Misra, D. (ed.). 17 ed. Pennington, NJ, Vol. 58. p. 29-36 8 p. (ECS Transactions; vol. 58, no. 17).

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Crystal microstructure
Grain growth
Electrodeposition
Electron diffraction
Grain boundaries
9 Citations (Scopus)

Submicrocristalline structure in copper after different severe plastic deformation schemes

Dobatkin, S. V., Salishchev, G. A., Kuznetsov, A. A. & Konkova, T., 2007, Recrystallization and Grain Growth III. Kang, S-J. L., Huh, M. Y., Hwang, N. M., Homma, H., Ushioda, K. & Ikuhara, Y. (eds.). PART 1 ed. Vol. 558-559. p. 189-194 6 p. (Materials Science Forum; vol. 558-559, no. PART 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution book

Roll bonding
Copper
Equal channel angular pressing
Plastic deformation
Oxygen