Research output per year
Research output per year
- 1 - 50 out of 98 results
Search results
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2024
Considerations for digitalisation of nickel electroforming
Roy, S. & Andreou, E., 1 Dec 2024, In: Transactions of the Institute of Metal Finishing. 102, 6, p. 297-304 8 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile1 Downloads (Pure) -
The multifaceted role of boric acid in nickel electrodeposition and electroforming
Tambe, C. E., Green, T. A. & Roy, S., 8 Oct 2024, In: Journal of the Electrochemical Society. 171, 10, 14 p., 102503.Research output: Contribution to journal › Article › peer-review
Open AccessFile1 Citation (Scopus)1 Downloads (Pure) -
Modelling and verification of the nickel electroforming process of a mechanical vane fit for Industry 4.0
Andreou, E. & Roy, S., Sept 2024, In: Digital Chemical Engineering. 12, 40 p., 100177.Research output: Contribution to journal › Article › peer-review
Open AccessFile1 Citation (Scopus)1 Downloads (Pure) -
2023
Influence of corrosion reactions on the pulse electrodeposition of metals and alloys
Green, T. A. & Roy, S., 11 Dec 2023, In: Journal of the Electrochemical Society. 170, 12, 14 p., 122503.Research output: Contribution to journal › Article › peer-review
Open AccessFile1 Citation (Scopus)35 Downloads (Pure) -
2022
Solubility analysis of 18 active pharmaceutical ingredients and intermediates in the non-polar solvents dioxane, toluene and cyclopentyl methyl ether
Moreno-Leon, C., Mack, C., Roy, S. & ter Horst, J. H., 1 Dec 2022, In: Journal of Molecular Liquids. 367, Part A, 120365.Research output: Contribution to journal › Article › peer-review
Open AccessFile3 Citations (Scopus)43 Downloads (Pure) -
Characteristics of anode materials for nickel electroforming
Green, T., Tambe, C. E. & Roy, S., 9 Sept 2022, In: Journal of the Electrochemical Society. 169, 9, 13 p., 092510.Research output: Contribution to journal › Article › peer-review
Open AccessFile5 Citations (Scopus)62 Downloads (Pure) -
Modelling the scaling-up of the nickel electroforming process
Andreou, E. & Roy, S., 25 Apr 2022, In: Frontiers in Chemical Engineering. 4, 26 p., 755725.Research output: Contribution to journal › Article › peer-review
Open AccessFile6 Citations (Scopus)79 Downloads (Pure) -
2021
Pulse electrodeposition of copper in the presence of a corrosion reaction
Green, T. A., Su, X. & Roy, S., 25 Jun 2021, In: Journal of the Electrochemical Society. 168, 6, 062515.Research output: Contribution to journal › Article › peer-review
Open AccessFile6 Citations (Scopus)194 Downloads (Pure) -
2020
Effect of water on the electrodeposition of copper from a deep eutectic solvent
Valverde, P. E., Green, T. A. & Roy, S., 30 Jun 2020, In: Journal of Applied Electrochemistry. 50, 6, p. 699-712 14 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile35 Citations (Scopus)64 Downloads (Pure) -
2019
Electrodeposition of Fe-Sn from the chloride-based electrolyte
Zajkoska, S. M., Mann, R., Hansal, W., Roy, S. & Kautek, W., 27 Aug 2019, (E-pub ahead of print) In: Transactions of the Institute of Metal Finishing. 97, 5, p. 247-253 7 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile1 Citation (Scopus)52 Downloads (Pure) -
2018
Voltammetric response of water in deep eutectic solvent based on choline chloride and urea
Bučko, M., Roy, S., Valverde-Armas, P., Onjia, A., Bastos, A. C. & Bajat, J. B., 20 Dec 2018, In: Journal of the Electrochemical Society. 165, 16, p. H1059-H1065 7 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile10 Citations (Scopus)101 Downloads (Pure) -
Ultrasonic agitation for emerging electrodeposition systems
Roy, S. & Coleman, S., 27 Aug 2018, (E-pub ahead of print) In: The Electrochemical Society: Interface. 27, 3, p. 53-57 5 p.Research output: Contribution to journal › Article
Open AccessFile2 Citations (Scopus)51 Downloads (Pure) -
Anodic reactions and the corrosion of copper in deep eutectic solvents
Green, T. A., Valverde, P. & Roy, S., 30 May 2018, In: Journal of the Electrochemical Society. 165, 9, p. D313-D320 8 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile22 Citations (Scopus)216 Downloads (Pure) -
Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gap
Coleman, S. J. & Roy, S., 30 Apr 2018, In: Ultrasonics Sonochemistry. 42, p. 445-451 7 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile5 Citations (Scopus)47 Downloads (Pure) -
Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives
Dela Pena, E. M. B. & Roy, S., 15 Apr 2018, In: Surface and Coatings Technology. 339, p. 101-110 10 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile44 Citations (Scopus)74 Downloads (Pure) -
2017
Copper electrodeposition from a water-containing choline chloride based deep eutectic solvent
Valverde, P., Green, T. & Roy, S., 1 Aug 2017, In: ECS Transactions. 77, 11, p. 859-864 6 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile10 Citations (Scopus)117 Downloads (Pure) -
Pulse plating of copper from deep eutectic solvents
Green, T., Su, X. & Roy, S., 1 Aug 2017, In: ECS Transactions. 77, 11, p. 1247-1253 7 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile10 Citations (Scopus)90 Downloads (Pure) -
Electrochemical effect of copper gleam additives during copper electrodeposition
Dela Pena, E. M. B. & Roy, S., 16 May 2017, In: Transactions of the Institute of Metal Finishing. 95, 3, p. 158-164 7 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile2 Citations (Scopus)132 Downloads (Pure) -
Application of a duplex diffusion layer model to pulse reverse plating
Green, T. A. & Roy, S., 19 Jan 2017, In: Transactions of the Institute of Metal Finishing. 95, 1, p. 46-51 6 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile12 Citations (Scopus)174 Downloads (Pure) -
2016
Fast degradation of dyes in water using manganese-oxide-coated diatomite for environmental remediation
Dang, T.-D., Banerjee, A. N., Tran, Q.-T. & Roy, S., 30 Nov 2016, In: Journal of Physics and Chemistry of Solids . 98, p. 50-58 9 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile47 Citations (Scopus)132 Downloads (Pure) -
Electrochemical copper recovery from galvanic sludge
Huyen, P. T., Dang, T. D., Tung, M. T., Huyen, N. T. T., Green, T. A. & Roy, S., 30 Sept 2016, In: Hydrometallurgy. 164, p. 295-303 9 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile36 Citations (Scopus)244 Downloads (Pure) -
Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method
Serrà, A., Coleman, S. J., Gómez, E., Green, T. A., Vallés, E., Vilana, J. & Roy, S., 20 Jul 2016, In: Electrochimica Acta. 207, p. 207-217 11 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile4 Citations (Scopus)105 Downloads (Pure) -
Metal recovery from low concentration solutions using a flow-by reactor under galvanostatic approach
Silva-Martínez, S. & Roy, S., 3 Feb 2016, In: Russian Journal of Electrochemistry. 52, 1, p. 71-77 7 p.Research output: Contribution to journal › Article › peer-review
3 Citations (Scopus) -
2015
Effect of additive concentration during copper deposition using EnFACE electrolyte
Dela Pena, E. M., Bains, N., Hussain, A., Cobley, A. & Roy, S., 30 Nov 2015, In: Transactions of the Institute of Metal Finishing. 93, 6, p. 288-293 6 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile3 Citations (Scopus)375 Downloads (Pure) -
Codeposition of Cu-Sn from ethaline deep eutectic solvent
Ghosh, S. & Roy, S., 20 Nov 2015, In: Electrochimica Acta. 183, p. 27-36 10 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile27 Citations (Scopus)110 Downloads (Pure) -
Electrochemical modification of titanium alloy influences osteoblast morphology and activity of cadherin-11 and rho-family GTPases
Johnson-Lynn, S. E., Roy, S., McCaskie, A. W. & Birch, M. A., 1 Nov 2015, In: Journal of Biomaterials and Tissue Engineering. 5, 11, p. 857-863 7 p.Research output: Contribution to journal › Article › peer-review
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Electrodeposition of copper patterns using Enface technique under ultrasonic agitation
Coleman, S. & Roy, S., 21 Aug 2015, In: Journal of Applied Electrochemistry. 45, 8, p. 889-898 10 p.Research output: Contribution to journal › Article › peer-review
7 Citations (Scopus) -
The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid
Pewnim, N. & Roy, S., 29 Jul 2015, In: Key Engineering Materials. 658, p. 125-128 4 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
Effect of fluorosurfactant additive during Cu-Sn codeposition from methanesulfonic acid
Pewnim, N. & Roy, S., 16 May 2015, In: Journal of the Electrochemical Society. 162, 8, p. D360-D364 5 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile8 Citations (Scopus)134 Downloads (Pure) -
Initial study of nickel electrolyte for EnFACE process
Widayatno, T. & Roy, S., 20 Mar 2015, In: International Journal of Science and Engineering. 8, 2, p. 135-140 6 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile3 Downloads (Pure) -
2014
Characterization of tin films synthesized from ethaline deep eutectic solvent
Ghosh, S. & Roy, S., 31 Dec 2014, In: Materials Science and Engineering B. 190, p. 104-110 7 p.Research output: Contribution to journal › Article › peer-review
28 Citations (Scopus) -
Combined pulsing currents and agitation for electrodeposition
Coleman, S. & Roy, S., 1 Dec 2014, In: Transactions of the Institute of Metal Finishing. 92, 6, p. 316-320 5 p.Research output: Contribution to journal › Article › peer-review
2 Citations (Scopus) -
Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gap
Coleman, S. & Roy, S., 3 Jul 2014, In: Chemical Engineering Science. 113, p. 35-44 10 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile36 Citations (Scopus)117 Downloads (Pure) -
Shewanella putrefaciens for the remediation of Au3+, Co2+ and Fe3+ metal ions from aqueous systems
Varia, J., Zegeye, A., Roy, S., Yahaya, S. & Bull, S., 15 Apr 2014, In: Biochemical Engineering Journal. 85, p. 101-109 9 p.Research output: Contribution to journal › Article › peer-review
26 Citations (Scopus) -
Nickel electrodeposition using EnFACE
Widayatno, T. & Roy, S., 28 Mar 2014, In: Journal of Applied Electrochemistry. 44, 7, p. 807-820 14 p.Research output: Contribution to journal › Article › peer-review
8 Citations (Scopus) -
Electrochemical and transport properties of ethaline containing copper and tin chloride
Ghosh, S., Ryder, K. & Roy, S., 31 Jan 2014, In: Transactions of the Institute of Metal Finishing. 92, 1, p. 41-46 6 p.Research output: Contribution to journal › Article › peer-review
27 Citations (Scopus) -
Electrochemical copper deposition from an ethaline-CuCl2·2H2O DES
Ghosh, S. & Roy, S., 15 Jan 2014, In: Surface and Coatings Technology. 238, p. 165-173 9 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile50 Citations (Scopus)29 Downloads (Pure) -
Electrodeposition of copper patterns using EnFACE technique under ultrasonic agitation
Coleman, S. J. & Roy, S., 2014, In: Chemical Engineering Transactions. 41, Special Issue, p. 37-42 6 p.Research output: Contribution to journal › Article › peer-review
5 Citations (Scopus) -
2013
Copper recovery from tin stripping solution: galvanostatic deposition in a batch-recycle system
Silva-Martínez, S. & Roy, S., 30 Oct 2013, In: Separation and Purification Technology. 118, p. 6-12 7 p.Research output: Contribution to journal › Article › peer-review
23 Citations (Scopus) -
Electrodeposited Ni and Ni-Co alloys using cysteine and conventional ultrasound waves
El-Feky, H., Negem, M., Roy, S., Helal, N. & Baraka, A., 17 Aug 2013, In: Science China Chemistry. 56, 10, p. 1446-1454 9 p.Research output: Contribution to journal › Article › peer-review
24 Citations (Scopus) -
Bioelectrochemical metal remediation and recovery of Au3+, Co2+ and Fe3+ metal ions
Varia, J., Martínez, S. S., Orta, S. V., Bull, S. & Roy, S., 15 Apr 2013, In: Electrochimica Acta. 95, p. 125-131 7 p.Research output: Contribution to journal › Article › peer-review
35 Citations (Scopus) -
Electrodeposition of tin-rich Cu-Sn alloys from a methanesulfonic acid electrolyte
Pewnim, N. & Roy, S., 15 Feb 2013, In: Electrochimica Acta. 90, p. 498-506 9 p.Research output: Contribution to journal › Article › peer-review
63 Citations (Scopus) -
2012
Effect of electrochemical structuring of Ti6Al4V on osteoblast behaviour in vitro
Birch, M. A., Johnson-Lynn, S., Nouraei, S., Wu, Q. B., Ngalim, S., Lu, W. J., Watchorn, C., Yang, T. Y., McCaskie, A. W. & Roy, S., 27 Apr 2012, In: Biomedical Materials. 7, 3, 035016.Research output: Contribution to journal › Article › peer-review
12 Citations (Scopus) -
Formation of dual diffusion layer by pulsing currents
Roy, S., 1 Feb 2012, In: Industrial and Engineering Chemistry Research. 51, 4, p. 1756-1760 5 p.Research output: Contribution to journal › Article › peer-review
11 Citations (Scopus) -
2011
A model for the corrosion of steel subjected to synthetic produced water containing sulfate, chloride and hydrogen sulfide
Smith, P., Roy, S., Swailes, D., Maxwell, S., Page, D. & Lawson, J., 1 Dec 2011, In: Chemical Engineering Science. 66, 23, p. 5775-5790 16 p.Research output: Contribution to journal › Article › peer-review
28 Citations (Scopus) -
Electrodeposition of microstructures using a patterned anode
Wu, Q.-B., Green, T. A. & Roy, S., 30 Nov 2011, In: Electrochemistry Communications. 13, 11, p. 1229-1232 4 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile15 Citations (Scopus)178 Downloads (Pure) -
Effect of fluorosurfactant on copper-tin reduction from methanesulphonic acid electrolyte
Pewnim, N. & Roy, S., 31 Jul 2011, In: Transactions of the Institute of Metal Finishing. 89, 4, p. 206-209 4 p.Research output: Contribution to journal › Article › peer-review
12 Citations (Scopus) -
2009
EnFACE: a maskless process for circuit fabrication
Roy, S., 21 Aug 2009, In: Circuit World. 35, 3, p. 8-11 4 p.Research output: Contribution to journal › Article › peer-review
4 Citations (Scopus) -
The recovery of copper and tin from waste tin stripping solution. Part II: kinetic analysis of synthetic and real process waste
Roy, S. & Buckle, R., 5 Aug 2009, In: Separation and Purification Technology. 68, 2, p. 185-192 8 p.Research output: Contribution to journal › Article › peer-review
22 Citations (Scopus) -
Microstructure and nanomechanical characterization of tissue engineered bone deposited on titanium alloy scaffolds
Chen, J., Birch, M. A., Bull, S. J. & Roy, S., Jul 2009, In: European Cells and Materials. 18, SUPPL. 2, p. 53 1 p.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus)