Sudipta Roy

Prof, PhD, FIChemE, CEng, FIMF, Head of Department and Chair of Chemical Engineering

  • United Kingdom

Accepting PhD Students

20112020

Research output per year

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Research Output

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Article
2020

Effect of water on the electrodeposition of copper from a deep eutectic solvent

Valverde, P. E., Green, T. A. & Roy, S., 30 Jun 2020, In : Journal of Applied Electrochemistry. 50, 6, p. 699-712 14 p.

Research output: Contribution to journalArticle

2019

Electrodeposition of Fe-Sn from the chloride-based electrolyte

Zajkoska, S. M., Mann, R., Hansal, W., Roy, S. & Kautek, W., 27 Aug 2019, In : Transactions of the Institute of Metal Finishing. 97, 5, p. 247-253 7 p.

Research output: Contribution to journalArticle

2018

Anodic reactions and the corrosion of copper in deep eutectic solvents

Green, T. A., Valverde, P. & Roy, S., 30 May 2018, In : Journal of the Electrochemical Society. 165, 9, p. D313-D320 8 p.

Research output: Contribution to journalArticle

Open Access
File
6 Citations (Scopus)
59 Downloads (Pure)

Design of an ultrasonic tank reactor for copper deposition at electrodes separated by a narrow gap

Coleman, S. J. & Roy, S., 30 Apr 2018, In : Ultrasonics Sonochemistry. 42, p. 445-451 7 p.

Research output: Contribution to journalArticle

Open Access
File
3 Citations (Scopus)
25 Downloads (Pure)

Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives

Dela Pena, E. M. B. & Roy, S., 21 Jan 2018, (Accepted/In press) In : Surface and Coatings Technology. p. 1-40 40 p.

Research output: Contribution to journalArticle

Open Access
File
25 Downloads (Pure)

Ultrasonic agitation for emerging electrodeposition systems

Roy, S. & Coleman, S., 27 Aug 2018, In : The Electrochemical Society: Interface. 27, 3, p. 53-57 5 p.

Research output: Contribution to journalArticle

Open Access
File
14 Downloads (Pure)

Voltammetric response of water in deep eutectic solvent based on choline chloride and urea

Bučko, M., Roy, S., Valverde-Armas, P., Onjia, A., Bastos, A. C. & Bajat, J. B., 20 Dec 2018, In : Journal of the Electrochemical Society. 165, 16, p. H1059-H1065 7 p.

Research output: Contribution to journalArticle

Open Access
File
3 Citations (Scopus)
28 Downloads (Pure)
2017

Application of a duplex diffusion layer model to pulse reverse plating

Green, T. A. & Roy, S., 19 Jan 2017, In : Transactions of the Institute of Metal Finishing. 95, 1, p. 46-51 6 p.

Research output: Contribution to journalArticle

Open Access
File
2 Citations (Scopus)
75 Downloads (Pure)

Copper electrodeposition from a water-containing choline chloride based deep eutectic solvent

Valverde, P., Green, T. & Roy, S., 1 Aug 2017, In : ECS Transactions. 77, 11, p. 859-864 6 p.

Research output: Contribution to journalArticle

Open Access
File
6 Citations (Scopus)
71 Downloads (Pure)

Electrochemical effect of copper gleam additives during copper electrodeposition

Dela Pena, E. M. B. & Roy, S., 16 May 2017, In : Transactions of the Institute of Metal Finishing. 95, 3, p. 158-164 7 p.

Research output: Contribution to journalArticle

Open Access
File
1 Citation (Scopus)
20 Downloads (Pure)

Pulse plating of copper from deep eutectic solvents

Green, T., Su, X. & Roy, S., 1 Aug 2017, In : ECS Transactions. 77, 11, p. 1247-1253 7 p.

Research output: Contribution to journalArticle

Open Access
File
3 Citations (Scopus)
58 Downloads (Pure)
2016

Electrochemical copper recovery from galvanic sludge

Huyen, P. T., Dang, T. D., Tung, M. T., Huyen, N. T. T., Green, T. A. & Roy, S., 30 Sep 2016, In : Hydrometallurgy. 164, p. 295-303 9 p.

Research output: Contribution to journalArticle

Open Access
File
12 Citations (Scopus)
192 Downloads (Pure)

Fast degradation of dyes in water using manganese-oxide-coated diatomite for environmental remediation

Dang, T-D., Banerjee, A. N., Tran, Q-T. & Roy, S., 30 Nov 2016, In : Journal of Physics and Chemistry of Solids . 98, p. 50-58 9 p.

Research output: Contribution to journalArticle

Open Access
File
21 Citations (Scopus)
65 Downloads (Pure)

Metal recovery from low concentration solutions using a flow-by reactor under galvanostatic approach

Silva-Martínez, S. & Roy, S., 3 Feb 2016, In : Russian Journal of Electrochemistry. 52, 1, p. 71-77 7 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)

Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method

Serrà, A., Coleman, S. J., Gómez, E., Green, T. A., Vallés, E., Vilana, J. & Roy, S., 20 Jul 2016, In : Electrochimica Acta. 207, p. 207-217 11 p.

Research output: Contribution to journalArticle

Open Access
File
3 Citations (Scopus)
52 Downloads (Pure)
2015

Codeposition of Cu-Sn from ethaline deep eutectic solvent

Ghosh, S. & Roy, S., 20 Nov 2015, In : Electrochimica Acta. 183, p. 27-36 10 p.

Research output: Contribution to journalArticle

Open Access
File
12 Citations (Scopus)
87 Downloads (Pure)

Effect of additive concentration during copper deposition using EnFACE electrolyte

Dela Pena, E. M., Bains, N., Hussain, A., Cobley, A. & Roy, S., 30 Nov 2015, In : Transactions of the Institute of Metal Finishing. 93, 6, p. 288-293 6 p.

Research output: Contribution to journalArticle

Open Access
File
3 Citations (Scopus)
251 Downloads (Pure)

Effect of fluorosurfactant additive during Cu-Sn codeposition from methanesulfonic acid

Pewnim, N. & Roy, S., 16 May 2015, In : Journal of the Electrochemical Society. 162, 8, p. D360-D364 5 p.

Research output: Contribution to journalArticle

Open Access
File
4 Citations (Scopus)
122 Downloads (Pure)

The role of fluorosurfactant on Cu-Sn electrodeposition from methanesulfonic acid

Pewnim, N. & Roy, S., 29 Jul 2015, In : Key Engineering Materials. 658, p. 125-128 4 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2014

Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gap

Coleman, S. & Roy, S., 3 Jul 2014, In : Chemical Engineering Science. 113, p. 35-44 10 p.

Research output: Contribution to journalArticle

Open Access
File
19 Citations (Scopus)
87 Downloads (Pure)

Electrochemical copper deposition from an ethaline-CuCl2·2H2O DES

Ghosh, S. & Roy, S., 15 Jan 2014, In : Surface and Coatings Technology. 238, p. 165-173 9 p.

Research output: Contribution to journalArticle

Open Access
File
33 Citations (Scopus)

Shewanella putrefaciens for the remediation of Au3+, Co2+ and Fe3+ metal ions from aqueous systems

Varia, J., Zegeye, A., Roy, S., Yahaya, S. & Bull, S., 15 Apr 2014, In : Biochemical Engineering Journal. 85, p. 101-109 9 p.

Research output: Contribution to journalArticle

5 Citations (Scopus)
2011

Electrodeposition of microstructures using a patterned anode

Wu, Q-B., Green, T. A. & Roy, S., 30 Nov 2011, In : Electrochemistry Communications. 13, 11, p. 1229-1232 4 p.

Research output: Contribution to journalArticle

Open Access
File
13 Citations (Scopus)
103 Downloads (Pure)