Fineplacer Pico flip-chip bonder

Institute Of Photonics

Facility/equipment: Equipment

  • Technology and Innovation Centre

Equipments Details

Description

Multi-purpose die bonder, with 5 microns X-Y positioning accuracy, 200-mm working field, thermocompression and other bonding modes.

Details

NameFineplacer Pico flip-chip bonder
Acquisition date27/05/16

Contact information

Emailsi.m.watson@strath.ac.uk
LinksWebsite