Description
Multi-purpose die bonder, with 5 microns X-Y positioning accuracy, 200-mm working field, thermocompression and other bonding modes.
Details
| Name | Fineplacer Pico flip-chip bonder |
|---|---|
| Acquisition date | 27/05/16 |
Technology and Innovation Centre
Technology and Innovation Centre
Multi-purpose die bonder, with 5 microns X-Y positioning accuracy, 200-mm working field, thermocompression and other bonding modes.
| Name | Fineplacer Pico flip-chip bonder |
|---|---|
| Acquisition date | 27/05/16 |