Research Output per year
This dataset relates to the publication "Test Structures for Developing Packaging for Implantable Sensors". It contains data recorded using microelectronic test structures for the purpose of characterising implantable sensor packaging. The data includes leakage current measurements to assess insulation integrity, reflectometer measurements to determine surface cleanliness after packaging, and electrical measurements for wire bond continuity.
|Date made available||15 Apr 2020|
|Publisher||University of Strathclyde|
|Date of data production||Jul 2016 - Aug 2019|
Blair, E. O., Buchoux, A., Tsiamis, A., Dunare, C., Marland, J. R. K., Gray, M. E., Terry, J. G., Smith, S. & Walton, A. J., 31 May 2020, In : IEEE Transactions on Semiconductor Manufacturing. 33, 2, p. 224-231 8 p.
Research output: Contribution to journal › Article
Blair, E. (Creator) (15 Apr 2020). Data for: "Test Structures for Developing Packaging for Implantable Sensors". University of Strathclyde. Data_from_Test_Structures_for_Developing_Packaging_for_Implantable_Sensors(.zip). 10.15129/f9eb43b5-9d4b-49fc-ad53-f565f03bfc78