Data for: "Test Structures for Developing Packaging for Implantable Sensors"

Dataset

Description

This dataset relates to the publication "Test Structures for Developing Packaging for Implantable Sensors". It contains data recorded using microelectronic test structures for the purpose of characterising implantable sensor packaging. The data includes leakage current measurements to assess insulation integrity, reflectometer measurements to determine surface cleanliness after packaging, and electrical measurements for wire bond continuity.
Date made available15 Apr 2020
PublisherUniversity of Strathclyde
Date of data productionJul 2016 - Aug 2019

Research Output

Test structures for developing packaging for implantable sensors

Blair, E. O., Buchoux, A., Tsiamis, A., Dunare, C., Marland, J. R. K., Gray, M. E., Terry, J. G., Smith, S. & Walton, A. J., 31 May 2020, In : IEEE Transactions on Semiconductor Manufacturing. 33, 2, p. 224-231 8 p.

Research output: Contribution to journalArticle

Open Access
File
  • Cite this

    Blair, E. (Creator) (15 Apr 2020). Data for: "Test Structures for Developing Packaging for Implantable Sensors". University of Strathclyde. Data_from_Test_Structures_for_Developing_Packaging_for_Implantable_Sensors(.zip). 10.15129/f9eb43b5-9d4b-49fc-ad53-f565f03bfc78