| Period | 31 Oct 2016 |
|---|---|
| Event type | Conference |
| Location | Shanghai, ChinaShow on map |
Related content
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Research output
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Molecular dynamics simulation study of deformation mechanisms in 3C-SiC during nanometric cutting at elevated temperatures
Research output: Contribution to journal › Article › peer-review
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Atomic-scale characterization of occurring phenomena during hot nanometric cutting of single crystal 3C-SiC
Research output: Contribution to journal › Article › peer-review
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Diamond machining of silicon: a review of advances in molecular dynamics simulation
Research output: Contribution to journal › Article › peer-review
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Dislocation-mediated plasticity in silicon during nanometric cutting: a molecular dynamics simulation study materials science in semiconductor processing
Research output: Contribution to journal › Article › peer-review
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High temperature nanoscratching of single crystal silicon under reduced oxygen condition
Research output: Contribution to journal › Article › peer-review
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Molecular dynamics simulation investigation on the plastic flow behaviour of silicon during nanometric cutting
Research output: Contribution to journal › Article › peer-review
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An atomistic simulation investigation on chip related phenomena in nanometric cutting of single crystal silicon at elevated temperatures
Research output: Contribution to journal › Article › peer-review
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Influence of temperature on the anisotropic cutting behaviour of single crystal silicon: a molecular dynamics simulation investigation
Research output: Contribution to journal › Article › peer-review
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Molecular dynamics simulation investigation of hot nanometric cutting of single crystal silicon
Research output: Contribution to conference › Paper › peer-review
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The investigation of influence of tool wear on ductile to brittle transition in single point diamond turning of silicon
Research output: Contribution to journal › Article › peer-review
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Projects